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Book Cover
Book
Author Hwang, Jennie S

Title Solder paste in electronics packaging : technology and applications in surface mount, hybrid circuits, and component assembly / Jennie S. Hwang.

Imprint New York : Van Nostrand Reinhold, c1992.

Copies

Description xxii, 456 p. : ill. ; 24 cm.
Bibliography Includes bibliographies and index.
Subject Printed circuits -- Design and construction
Solder pastes
Surface mount technology
ISBN 0442207549
0442013531 (pbk)
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